Researchers at Arizona State University have developed a process to integrate copper and form a copper oxide contact or silver-doped copper oxide contacts that interconnect on a variety of substrates used for biosensors, flexible displays, electronics, and solar devices. The new process produces a faster attachment in less than two minutes. Additionally, the procedure only requires temperatures to reach 45°C, and it will work with delicate materials such as polymer substrates like polyethylnapthalate (PEN). A natural barrier layer develops on the outside of the copper, creating a copper oxide compound that protects the copper and prevents the compound from diffusing into the host material. The alloy also exhibits low resistivity characteristics.
- Flexible screen displays
- Solar cells
- Integrated circuits
- Light-emitting diodes
Benefits and Advantages
- Lower Costs – The process uses less energy due to its fast application rate and low temperature requirements.
- Fast Application – Simple process takes less-than two minutes.
- Larger Market – Works with a wider variety of materials including plastics.
- Better Miniaturization - Lower resistivity allows for smaller circuits.
For more information about the inventor(s) and their research, please see
Dr. Terry Alford's directory webpage