Researchers at Arizona State University have developed a process to integrate copper germanide (Cu3Ge) contacts and interconnect on a variety of substrates used for display, electronics and solar devices. The new process produces a faster attachment in approximately one minute. Additionally, the procedure only requires temperatures to reach 80°C, and will work with delicate materials such as plastics. A natural barrier layer develops on the outside of the copper germanide that protects the Cu3Ge, and prevents the Cu3Ge from diffusing into the host material. The alloy exhibits low resistivity characteristics similar to copper.
- Flexible screen displays.
- Solar cells.
- Integrated circuits.
- Light-emitting diodes.
Benefits and Advantages
- Lower Costs – The process uses less energy due to its fast application rate and low temperature requirements.
- Fast Application – Simple process only takes one minute.
- Larger Market – Works with more materials including plastics.
- Better Miniaturization - Lower resistivity allows for smaller circuits.
For more information about the inventor(s) and their research, please see
Dr. Terry Alford's directory webpage