Researchers at ASU have developed a TIM with improved thermal conductivity achieved through addition of solid additives as well as liquid metal drops. This novel approach combines the two current approaches in which either only solid particles or only liquid metal drops are used. The liquid metal acts as a high thermal conductivity filler with the ability to withstand large deformation due to its liquid state. Furthermore, the liquid metal reduces interfacial resistance of the other high thermal conductivity solid additive particles.
- Microgap filling in integrated circuit chip and flip chip interfaces
Benefits and Advantages
- Improved Thermal Conductivity – The combination of liquid metal and solid additives increases the thermal conductivity in contrast to TIMs that use only liquid metal or only solid additives
- Innovative – The heterostructures can come in various shapes such as plates, sheets and branched structures
- Tunable Rheology – The choice of functional oxide surface enables the metal oxide growth rate to be controllably slowed
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