Researchers at ASU have developed a stereo vision measurement system that uses contour mapping to match groups of similar pixels resembling curves on the solder ball’s surface. Ring lighting around each camera lens provides directional light that enhances spatial definition when reflected. Once the images have been captured, software generates a contour map based on the intensity of the reflected light and calculates individual ball height after triangulating points for each ball’s apex and base. This method has been tested to be accurate to within four micrometers of the leading conventional solder ball inspection tools. Therefore, this stereo vision measurement system offers reliable quality control at a fraction of the cost.
- BGA (Ball Grid Array) Soldering
- Flip Chip Manufacturing
- Quality Control for the Manufacturing of
- Integrated Circuits
- Random Access Memory
- Semiconductor Packaging
Benefits and Advantages
- Economical – Less expensive than laser profiling, fringe projection, and confocal microscopy.
- Effective – Accurate within four micrometers of the leading conventional solder ball inspection tools.
- Practical – Saves manufacturing time without sacrificing quality.
For more information about the inventor(s) and their research, please see